3D-MID represents a new dimension. For the first time, it is now possible to combine mechanical and electronic functions in the smallest of spaces. With its own technology centre, which combines all the process steps under a single roof, Cicor has perfected its offerings.
Smallest and most precise. The trend towards miniaturisation and rationalisation in the electronics industry continues unabated - more benefits within the same space is the name of the game. And the new 3D-MID technology makes this possible.
3D-MID stands for Moulded Interconnect Devices or three-dimensional injection moulded circuit boards. By integrating mechanical and electronic functions and three-dimensional design the optimal usage of space is achieved. Moreover, large scale integration density of mechanical and electronic functions is possible and savings can be made on components and process steps. In turn, this affords a high degree of design flexibility.
The focus of the 3D-MID centre of excellence is on development and customer-specific applications for 3D-MID products. All process steps – from injection moulding, laser applications and metallization up to Electronic Assembly are brought together within the Cicor group. The customer benefits on the one hand from bundled skills whilst short paths, rapid decisions and on-site coordination guarantee maximum process speed on the other.
This one-stop shop solution offers even more advantages. Thanks to the close collaboration across all disciplines at a single site Cicor creates added-value from which everybody benefits. Cicor is focusing on solutions not on problems. It is no accident that Cicor is the leader in 3D-MID technology: Cicor, on the one hand, has many years of experience in all the process steps required to manufacture 3D-MID products. At the same time, Cicor is in the possession of long-standing application expertise in the markets that take advantage of 3D-MID. Experience in the entire process chain, combined with this know-how, enables Cicor to offer bespoke solutions that are completely convincing. Thus the 3D-MID technology centre in Boudry is “only” a logical consequence and unerring answer to the trend towards miniaturisation and rationalisation within the electronics industry.